Inventor
SANDSTROM CLIFFORD
US16 patents
Patents
16 patentsUS11616003B2Mar 28, 2023
Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects
DECA TECH USA INC2 citations71
US11444051B2Sep 13, 2022
Fully molded semiconductor structure with face mounted passives and method of making the same
DECA TECH USA INC2 citations69
US12424527B2Sep 23, 2025
Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages
DECA TECH USA INC1 citations63
US12381154B2Aug 5, 2025
Fully molded bridge interposer and method of making the same
DECA TECH USA INC0 citations62
US11538759B2Dec 27, 2022
Fully molded bridge interposer and method of making the same
DECA TECH USA INC0 citations62
US12438065B2Oct 7, 2025
Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects
DECA TECH USA INC0 citations61
US12170261B2Dec 17, 2024
Molded direct contact interconnect structure without capture pads and method for the same
DECA TECH USA INC0 citations61
US12057373B2Aug 6, 2024
Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same
DECA TECH USA INC0 citations61
US11973051B2Apr 30, 2024
Molded direct contact interconnect structure without capture pads and method for the same
DECA TECH USA INC0 citations61
US11728248B2Aug 15, 2023
Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects
DECA TECH USA INC1 citations61
US12506102B2Dec 23, 2025
Fully molded semiconductor structure with face mounted passives and method of making the same
DECA TECH USA INC0 citations58
US12500197B2Dec 16, 2025
Encapsulant-defined land grid array (LGA) package and method for making the same
DECA TECH USA INC0 citations51
US12500198B2Dec 16, 2025
Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same
DECA TECH USA INC0 citations51
US12300561B2May 13, 2025
Fully molded structure with multi-height components comprising backside conductive material and method for making the same
DECA TECH USA INC0 citations51
US11749534B1Sep 5, 2023
Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same
DECA TECH USA INC0 citations51
US11664321B2May 30, 2023
Multi-step high aspect ratio vertical interconnect and method of making the same
DECA TECH USA INC0 citations51