Inventor · disambiguated record
Alphonso P. Lanzetta
Also filed as: LANZETTA ALPHONSO P · LANZETTA ALPHONSO PHILIP
33 granted patents·935 citations·filing 1990–2009
98Inventor score
Top patents by PatentIndex Score
33 records- 0194US5433631AFlex circuit card elastomeric cable connector assemblyIBM·Filed 1994·Granted Jul 18, 1995·85 cites·5 claims
- 0291US7492821B2System and method for selective image capture, transmission and reconstructionIBM·Filed 2005·Granted Feb 17, 2009·25 cites·1 claims
- 0391US6326696B1Electronic package with interconnected chipsIBM·Filed 1998·Granted Dec 4, 2001·107 cites·22 claims
- 0490US7452212B2Metalized elastomeric electrical contactsIBM·Filed 2005·Granted Nov 18, 2008·16 cites·1 claims
- 0586US5559670AConvertible display computerIBM·Filed 1994·Granted Sep 24, 1996·109 cites·6 claims
- 0686US5386344AFlex circuit card elastomeric cable connector assemblyIBM·Filed 1993·Granted Jan 31, 1995·51 cites·18 claims
- 0782US5268815AHigh density, high performance memory circuit packageIBM·Filed 1992·Granted Dec 7, 1993·74 cites·18 claims
- 0879US6276844B1Clustered, buffered simms and assemblies thereofIBM·Filed 1996·Granted Aug 21, 2001·53 cites·6 claims
- 0979US6019530AKeyboards with retractable keysIBM·Filed 1998·Granted Feb 1, 2000·31 cites·14 claims
- 1078US5583510APlanar antenna in the ISM band with an omnidirectional pattern in the horizontal planeIBM·Filed 1994·Granted Dec 10, 1996·49 cites·20 claims
- 1177US8174106B2Through board stacking of multiple LGA-connected componentsCOTEUS PAUL W·Filed 2006·Granted May 8, 2012·6 cites·20 claims
- 1276US6306686B1Method of fabricating an electronic package with interconnected chipsIBM·Filed 2000·Granted Oct 23, 2001·22 cites·5 claims
- 1374US7771208B2Metalized elastomeric electrical contactsIBM·Filed 2008·Granted Aug 10, 2010·5 cites·34 claims
- 1473US8832936B2Method of forming metallized elastomeric electrical contactsHOUGHAM GARETH GEOFFREY·Filed 2009·Granted Sep 16, 2014·5 cites·14 claims
- 1571US5581576ARadio information broadcasting and receiving systemIBM·Filed 1995·Granted Dec 3, 1996·70 cites·7 claims
- 1667US8054095B2Metalized elastomeric probe structureIBM·Filed 2005·Granted Nov 8, 2011·4 cites·38 claims
- 1766US8278745B2Through board stacking of multiple LGA-connected componentsCOTEUS PAUL W·Filed 2009·Granted Oct 2, 2012·2 cites·13 claims
- 1866US7613368B2Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal typesIBM·Filed 2004·Granted Nov 3, 2009·9 cites·16 claims
- 1963US5117275AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1990·Granted May 26, 1992·28 cites·12 claims
- 2061US6009247APortable computer networkIBM·Filed 1996·Granted Dec 28, 1999·46 cites·6 claims
- 2159US5546655AMethod of applying flex tape protective coating onto a flex productIBM·Filed 1994·Granted Aug 20, 1996·21 cites·25 claims
- 2256US5052606ATape automated bonding feederIBM·Filed 1990·Granted Oct 1, 1991·27 cites·16 claims
- 2349US8582648B2System and method for selective image capture, transmission and reconstructionBERMAN STEVEN T·Filed 2009·Granted Nov 12, 2013·0 cites·18 claims
- 2449US5421079AHigh density, high performance memory circuit packageIBM·Filed 1993·Granted Jun 6, 1995·14 cites·5 claims
- 2548US5360946AFlex tape protective coatingIBM·Filed 1991·Granted Nov 1, 1994·13 cites·16 claims
- 2648US5229328AMethod for bonding dielectric mounted conductors to semiconductor chip contact padsIBM·Filed 1992·Granted Jul 20, 1993·17 cites·20 claims
- 2746US5734196AElectronic packaging shaped beam lead fabricationIBM·Filed 1995·Granted Mar 31, 1998·12 cites·6 claims
- 2842US5233221AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1991·Granted Aug 3, 1993·11 cites·17 claims
- 2939US5675884AApparatus for multilayer conductor chip packagingIBM·Filed 1995·Granted Oct 14, 1997·6 cites·6 claims
- 3038US6403892B1Coated means for connecting a chip and a cardIBM·Filed 1996·Granted Jun 11, 2002·6 cites·9 claims
- 3138US5768770AElectronic packaging shaped beam lead fabricationFiled 1995·Granted Jun 23, 1998·5 cites·10 claims
- 3236US5558523APad on pad type contact interconnection technology for electronic apparatusIBM·Filed 1994·Granted Sep 24, 1996·6 cites·7 claims
- 3330US5322204AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1993·Granted Jun 21, 1994·0 cites·5 claims
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