Inventor

SYED AHMER

US10 patents

⚠️ This page may combine multiple inventors who share the name “SYED AHMER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AMKOR TECHNOLOGY INC

4 patents

US7183630B1Feb 27, 2007

Lead frame with plated end leads

AMKOR TECHNOLOGY INC90 citations94

US9484291B1Nov 1, 2016

Robust pillar structure for semicondcutor device contacts

AMKOR TECHNOLOGY INC38 citations91

US6885086B1Apr 26, 2005

Reduced copper lead frame for saw-singulated chip package

AMKOR TECHNOLOGY INC29 citations90

US10236268B1Mar 19, 2019

Robust pillar structure for semicondcutor device contacts

AMKOR TECHNOLOGY INC4 citations70

QUALCOMM INC

2 patents

US12218041B2Feb 4, 2025

Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods

QUALCOMM INC1 citations63

US12500188B2Dec 16, 2025

Flip-chip bumping metal layer and bump structure

QUALCOMM INC0 citations51

(unassigned)

1 patent

US6608366B1Aug 19, 2003

Lead frame with plated end leads

152 citations94

KUO BOB SHIH-WEI

1 patent

US9013011B1Apr 21, 2015

Stacked and staggered die MEMS package and method

KUO BOB SHIH-WEI18 citations82

GALLOWAY JESSE E

1 patent

US8217507B1Jul 10, 2012

Edge mount semiconductor package

GALLOWAY JESSE E8 citations78

SYED AHMER

1 patent

US8912051B1Dec 16, 2014

Method for controlling molding compound geometry around a semiconductor die

SYED AHMER3 citations50