Inventor · disambiguated record
Shin-Hua Chao
Also filed as: CHAO SHIN-HUA
17 granted patents·6 pending applications·421 citations·filing 1999–2018
94Inventor score
Top patents by PatentIndex Score
23 records- 0191US7041534B2Semiconductor chip package and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 9, 2006·70 cites·10 claims
- 0290US6229702B1Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capabilityADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted May 8, 2001·123 cites·19 claims
- 0386US6483187B1Heat-spread substrateADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Nov 19, 2002·61 cites·18 claims
- 0483US6624523B2Structure and package of a heat spreader substrateADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Sep 23, 2003·41 cites·21 claims
- 0582US10141252B2Semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 27, 2018·4 cites·15 claims
- 0675US7614888B2Flip chip package processADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 10, 2009·7 cites·12 claims
- 0773US7060595B2Circuit substrate and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 13, 2006·22 cites·14 claims
- 0873US6918178B2Method of attaching a heat sink to an IC packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 19, 2005·26 cites·11 claims
- 0972US6348729B1Semiconductor chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Feb 19, 2002·42 cites·10 claims
- 1068US7445944B2Packaging substrate and manufacturing method thereofASE SHANGHAI INC·Filed 2006·Granted Nov 4, 2008·5 cites·14 claims
- 1161US6573123B2Semiconductor chip package and manufacturing method thereofFiled 2001·Granted Jun 3, 2003·11 cites·16 claims
- 1253US10867899B2Semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 15, 2020·0 cites·21 claims
- 1352US6355499B1Method of making ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 12, 2002·8 cites·11 claims
- 1451US8889488B2Method for manufacturing semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 18, 2014·0 cites·20 claims
- 1544US7151317B2Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Dec 19, 2006·1 cites·16 claims
- 1643US2007046314A1Process for testing IC waferADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1741US2008044931A1Packaging substrate and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1839US8546950B2Semiconductor package and manufacturing method thereofCHAO SHIN-HUA·Filed 2010·Granted Oct 1, 2013·0 cites·19 claims
- 1939US2005019965A1Process for testing IC waferADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2038US2005095750A1Wafer level transparent packagingADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2136US8059422B2Thermally enhanced package structureTONG HO-MING·Filed 2008·Granted Nov 15, 2011·0 cites·14 claims
- 2232US2006103020A1Redistribution layer and circuit structure thereofTONG HO-MING·Filed 2005·Application pending·0 cites
- 2324US2010289133A1Stackable Package Having Embedded Interposer and Method for Making the SameCHAO SHIN-HUA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →