Inventor · disambiguated record
Kabir Mirpuri
Also filed as: MIRPURI KABIR · MIRPURI KABIR J
13 granted patents·3 pending applications·6 citations·filing 2015–2023
83Inventor score
Top patents by PatentIndex Score
16 records- 0192US11557525B2Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elementsNXP USA INC·Filed 2021·Granted Jan 17, 2023·3 cites·11 claims
- 0286US11515238B2Power die packageNXP USA INC·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 0382US11521947B1Space efficient flip chip joint designNXP USA INC·Filed 2021·Granted Dec 6, 2022·1 cites·20 claims
- 0475US12199064B2Substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (FC) jointsNXP USA INC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 0570US11935809B2Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elementsNXP USA INC·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 0664US11875988B2Substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (FC) jointsNXP USA INC·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 0757US11721642B2Semiconductor device package connector structure and method thereforNXP USA INC·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 0856US11705410B2Semiconductor device having integrated antenna and method thereforNXP USA INC·Filed 2020·Granted Jul 18, 2023·0 cites·20 claims
- 0956US2025063657A1Reusable modular substrateNXP USA INC·Filed 2023·Application pending·0 cites
- 1055US11817366B2Semiconductor device package having thermal dissipation feature and method thereforNXP USA INC·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 1155US10391590B2High temperature solder pasteINTEL CORP·Filed 2018·Granted Aug 27, 2019·0 cites·10 claims
- 1250US10086479B2High temperature solder pasteINTEL CORP·Filed 2016·Granted Oct 2, 2018·0 cites·9 claims
- 1349US12406896B2Semiconductor device package having thermal dissipation feature and method thereforNXP USA INC·Filed 2021·Granted Sep 2, 2025·0 cites·15 claims
- 1438US10037898B2Water soluble flux with modified viscosityINTEL CORP·Filed 2016·Granted Jul 31, 2018·0 cites·7 claims
- 1533US2019067176A1Void reduction in solder joints using off-eutectic solderINTEL CORP·Filed 2016·Application pending·0 cites
- 1631US2017066088A1Ball grid array (bga) apparatus and methodsINTEL CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →