Inventor

COOPER EMANUEL I

US53 patents

⚠️ This page may combine multiple inventors who share the name “COOPER EMANUEL I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COOPER EMANUEL I

ENTEGRIS INC

Post-CMP removal using compositions and method of use

Aqueous formulations for removing metal hard mask and post-etch residue with Cu/W compatibility

Wet etching composition and method

Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility

Silicon nitride etching composition and method

Compositions and methods for selectively etching titanium nitride

Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility

Compositions and methods for selectively etching titanium nitride

Compositions and methods for selectively etching titanium nitride

Compositions and methods for the selective removal of silicon nitride

Ruthenium etching composition and method

Formulations to selectively etch silicon germanium relative to germanium

Formulations to selectively etch silicon and germanium

Method for removing hard masks

Silicon nitride etching composition and method

Compositions and methods for selectively etching silicon nitride films

Dopant precursors for mono-layer doping

Composition and process for selectively etching p-doped polysilicon relative to silicon nitride

Passivation of germanium surfaces

Post-etch residue removal for advanced node beol processing

Cleaning compositions for removing post etch residue

Method and composition for etching molybdenum

Compositions and methods for removing ceria particles from a surface

IBM

Field effect transistor with electroplated metal gate

Sealed DASD having humidity control and method of making same

Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates

Lead free conductive composites for electrical interconnections

Method for cleaning semiconductor devices

Method for cleaning semiconductor devices

Lead free conductive composites for electrical interconnections

Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess

Field effect transistor with electroplated metal gate

Process for producing ceramic circuit structures having conductive vias

Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow

Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow

Method for isotropic etching of copper

Electroplated CoWP composite structures as copper barrier layers

Method for kinetically controlled etching of copper

Barrier for interconnect and method

Immersion plating and plated structures

Immersion plating and plated structures

ADVANCED TECH MATERIALS

Sulfolane mixtures as ambient aprotic polar solvents

Compositions and methods for the selective removal of silicon nitride

Composition and process for stripping photoresist from a surface including titanium nitride

COOPER EMANUEL I

Compositions and methods for the selective removal of silicon nitride

Composition for and method of suppressing titanium nitride corrosion

AFZALI-ARDAKANI ALI

Aqueous cerium-containing solution having an extended bath lifetime for removing mask material

CHEN TIANNIU

Composition and process for selectively etching metal nitrides

BARNES JEFFREY A

Compositions and methods for selectively etching titanium nitride

ADVANCED TECH MATERIALS INC

Compositions and methods for selectively etching titanium nitride