Inventor

KIM YONG HOON

KR121 patents

⚠️ This page may combine multiple inventors who share the name “KIM YONG HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM YONG HOON

SAMSUNG ELECTRONICS CO LTD

Exposure apparatus including micro mirror array and exposure method using the same

Mask blank and method of fabricating phase shift mask from the same

Acousto-optic modulator

Apparatus and a method for combining light beams by using two flat plates with an air gap therebetween

Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer

Semiconductor package

Semiconductor package having EMI shielding function and heat dissipation function

System comprising electronic device and external device storing boot code for booting system

Acoustic-optic modulator having two transducers

Beamforming method and apparatus for serving multiple users

Method of fabricating phase shift mask

Apparatus for separating a light beam by using two flat plates with an air gap therebetween and hybrid dichroic mirrors and a method therefor

Semiconductor package with sidewall contacting bonding tape

Semiconductor package

Duobinary optical transmission apparatus

Image sensor package having multi-level stack structure

Image sensor package having multi-level stack structure

Method and device for transmitting and receiving signal by using multiple beams in wireless communication system

Array antenna apparatus for implementing predetermined beam width using predetermined number of antenna elements

Photo mask of semiconductor device and method for manufacturing the same

Integrated circuit for generating a melody and ring

Semiconductor package with improved power integrity

Multi-chip package and method of manufacturing the same

KIM YONG-HOON

Semiconductor package

Stacked package structure including insulating layer between two stacked packages

Semiconductor device including shielding layer and fabrication method thereof

Embedded chip-on-chip package and package-on-package comprising same

Semiconductor package stack having a heat slug

Methods of booting application processors from external devices

Package on package having improved thermal characteristics

Semiconductor package with package on package structure

Semiconductor device and method for operating the same

Semiconductor package

SAMSUNG ELECTRO MECH

Substrate having embedded interconnect structure

Electronic component embedded substrate

Component package and printed circuit board for the same

Electronic component embedded substrate

Substrate structure and electronic device including the same

Substrate structure and electronic device including the same

KIM YONG HOON

Housing-type golf-simulation apparatus

Semiconductor memory apparatus and method for correcting duty thereof

HYUNDAI MOTOR CO LTD

Exhaust gas recirculation cooler

Intake air control apparatus for vehicle

LG ELECTRONICS INC

Audio/video synchronizer

FURUKAWA ELECTRIC CO LTD

Multilayer insulated wire and transformer using the same

SK TELETECH CO LTD

File construction for mobile communication device including machine-language-code execution segment and file execution method using the same

KWON HEUNG-KYU

Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements

KANG UN-BYOUNG

Multi-chip package and method of manufacturing the same

KOREA ADVANCED INST SCI & TECH

First-principles-derived effective mass approximation simulation method and system for accurate and efficient computational design of electronic structure and optical properties of quantum nanostructures

HYNIX SEMICONDUCTOR INC

Delay locked loop