P

Inventor

LEE SEUNG EUN

KR98 patents
⚠️ This page may combine multiple inventors who share the name “LEE SEUNG EUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

20 patents
US9462697B2Oct 4, 2016

Electronic component embedded substrate and manufacturing method thereof

SAMSUNG ELECTRO MECH13 citations84
US9307632B2Apr 5, 2016

Multilayered substrate and method of manufacturing the same

SAMSUNG ELECTRO MECH14 citations82
US7736397B2Jun 15, 2010

Method for manufacturing capacitor embedded in PCB

SAMSUNG ELECTRO MECH15 citations82
US10881004B1Dec 29, 2020

Electronic component embedded substrate

SAMSUNG ELECTRO MECH6 citations73
US9788433B2Oct 10, 2017

Circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH2 citations73
US9526177B2Dec 20, 2016

Printed circuit board including electronic component embedded therein and method for manufacturing the same

SAMSUNG ELECTRO MECH3 citations73
US9420683B2Aug 16, 2016

Substrate embedding passive element

SAMSUNG ELECTRO MECH4 citations73
US9788409B2Oct 10, 2017

Circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH3 citations72
US10952319B1Mar 16, 2021

Electronic component embedded substrate

SAMSUNG ELECTRO MECH3 citations71
US10153235B2Dec 11, 2018

Image sensor device and image sensor module comprising the same

SAMSUNG ELECTRO MECH3 citations71
US12295100B2May 6, 2025

Printed circuit board including bonding layer, having conductive particles, disposed between core portions

SAMSUNG ELECTRO MECH0 citations63
US12108534B2Oct 1, 2024

Substrate structure and electronic device including the same

SAMSUNG ELECTRO MECH0 citations63
US11350529B2May 31, 2022

Substrate structure and electronic device including the same

SAMSUNG ELECTRO MECH0 citations63
US11963311B2Apr 16, 2024

Printed circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations62
US11758655B2Sep 12, 2023

Printed circuit board

SAMSUNG ELECTRO MECH1 citations62
US11576261B2Feb 7, 2023

Connection structure embedded substrate

SAMSUNG ELECTRO MECH1 citations62
US10887995B2Jan 5, 2021

Method for manufacturing a printed circuit board including an embedded electronic component

SAMSUNG ELECTRO MECH0 citations62
US10270948B2Apr 23, 2019

Substrate for camera module and camera module having the same

SAMSUNG ELECTRO MECH1 citations62
US7845073B2Dec 7, 2010

Method of manufacturing circuit board embedding thin film capacitor

SAMSUNG ELECTRO MECH3 citations62
US12114428B2Oct 8, 2024

Electronic component embedded substrate

SAMSUNG ELECTRO MECH0 citations61

LG ELECTRONICS INC

9 patents

SAMSUNG ELECTRONICS CO LTD

9 patents

UNIV HANYANG IND UNIV COOP FOUND

4 patents

LEE SEUNG-EUN

2 patents

MERCK PATENT GMBH

1 patent

CZANTA MARKUS

1 patent

YOON KYUNG HEE

1 patent

IUCF HYU

1 patent

JEONG TAE SUNG

1 patent

FANG ZHEN

1 patent

Showing the top 50 of 98 patents by PatentIndex Score.