Inventor
LIU YUELI
US16 patents
⚠️ This page may combine multiple inventors who share the name “LIU YUELI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
14 patentsUS9147663B2Sep 29, 2015
Bridge interconnection with layered interconnect structures
INTEL CORP34 citations97
US9147638B2Sep 29, 2015
Interconnect structures for embedded bridge
INTEL CORP51 citations93
US11133257B2Sep 28, 2021
Bridge interconnection with layered interconnect structures
INTEL CORP4 citations83
US9640485B2May 2, 2017
Bridge interconnection with layered interconnect structures
INTEL CORP8 citations83
US9113573B2Aug 18, 2015
Molded insulator in package assembly
INTEL CORP6 citations83
US11694960B2Jul 4, 2023
Bridge interconnection with layered interconnect structures
INTEL CORP2 citations72
US12132002B2Oct 29, 2024
Bridge interconnection with layered interconnect structures
INTEL CORP0 citations62
US10957667B2Mar 23, 2021
Indium solder metallurgy to control electro-migration
INTEL CORP0 citations62
US9355952B2May 31, 2016
Device packaging with substrates having embedded lines and metal defined pads
INTEL CORP0 citations52
US9093313B2Jul 28, 2015
Device packaging with substrates having embedded lines and metal defined pads
INTEL CORP0 citations52
US10475745B2Nov 12, 2019
Bridge interconnection with layered interconnect structures
INTEL CORP0 citations51
US10103103B2Oct 16, 2018
Bridge interconnection with layered interconnect structures
INTEL CORP0 citations51
US9502336B2Nov 22, 2016
Coreless substrate with passive device pads
INTEL CORP1 citations51
US9412625B2Aug 9, 2016
Molded insulator in package assembly
INTEL CORP1 citations51