Inventor

ZHANG QINGLEI

US21 patents

⚠️ This page may combine multiple inventors who share the name “ZHANG QINGLEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHANG QINGLEI

INTEL CORP

Bridge interconnection with layered interconnect structures

Interconnect structures for embedded bridge

Integrated circuit package substrate

Integrated circuit package substrate

Bridge interconnection with layered interconnect structures

Bridge interconnection with layered interconnect structures

Methods of forming substrate microvias with anchor structures

Bridge interconnection with layered interconnect structures

Integrated circuit package substrate

Bridge interconnection with layered interconnect structures

Integrated circuit package substrate

Integrated circuit package substrate

Integrated circuit package substrate

Low z-height package assembly

Methods of forming substrate microvias with anchor structures

Integrated circuit package substrate

Bridge interconnection with layered interconnect structures

Bridge interconnection with layered interconnect structures

Coreless substrate with passive device pads

ZHANG CHONG

Laser cavity formation for embedded dies or components in substrate build-up layers

ZHANG QINGLEI

Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package