Inventor

SCHUCKMAN AMANDA E

US21 patents

⚠️ This page may combine multiple inventors who share the name “SCHUCKMAN AMANDA E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHUCKMAN AMANDA E

INTEL CORP

Bridge interconnection with layered interconnect structures

Package with bi-layered dielectric structure

Bridge interconnection with layered interconnect structures

Tin-zinc microbump structures

Bridge interconnection with layered interconnect structures

Metal protected fan-out cavity

Bridge interconnection with layered interconnect structures

Copper seed layer and nickel-tin microbump structures

High density organic interconnect structures

Bridge interconnection with layered interconnect structures

High density organic interconnect structures

High density organic interconnect structures

High density organic interconnect structures

Semiconductor device including silane based adhesion promoter and method of making

Desmear with metalized protective film

Bridge interconnection with layered interconnect structures

Tin-zinc microbump structures and method of making same

Bridge interconnection with layered interconnect structures

Electronic assembly that includes void free holes

Systems and methods for semiconductor packages using photoimageable layers

SCHUCKMAN AMANDA E

Providing a void-free filled interconnect structure in a layer of package substrate