Inventor

RAORANE DIGVIJAY

US18 patents

⚠️ This page may combine multiple inventors who share the name “RAORANE DIGVIJAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RAORANE DIGVIJAY

INTEL CORP

IC package including multi-chip unit with bonded integrated heat spreader

IC package including multi-chip unit with bonded integrated heat spreader

Nested architectures for enhanced heterogeneous integration

IC package including multi-chip unit with bonded integrated heat spreader

Nested architectures for enhanced heterogeneous integration

Die with embedded communication cavity

Electronic package with corner supports

Nested architectures for enhanced heterogeneous integration

IC package including multi-chip unit with bonded integrated heat spreader

Open cavity bridge co-planar placement architectures and processes

Nested architectures for enhanced heterogeneous integration

Open cavity bridge power delivery architectures and processes

Dummy die structures of a packaged integrated circuit device

Method to achieve variable dielectric thickness in packages for better electrical performance

Die with embedded communication cavity

Semiconductor package with electromagnetic interference shielding using metal layers and vias

Apparatus and system with package stiffening magnetic inductor core and methods of making the same

SIRAJUDDIN KHALID M

Method of forming a deep trench in a substrate