Inventor
MEKONNEN YIDNEKACHEW
US3 patents
Patents
3 patentsUS11276635B2Mar 15, 2022
Horizontal pitch translation using embedded bridge dies
INTEL CORP2 citations71
US11694952B2Jul 4, 2023
Horizontal pitch translation using embedded bridge dies
INTEL CORP0 citations61
US11145583B2Oct 12, 2021
Method to achieve variable dielectric thickness in packages for better electrical performance
INTEL CORP0 citations57