Inventor

MOON JONG-TAE

KR23 patents

⚠️ This page may combine multiple inventors who share the name “MOON JONG-TAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOON JONG-TAE

KOREA ELECTRONICS TELECOMM

Optical module having lenses aligned on lens-positioning V-groove and fabrication method thereof

Optical module package of flip chip bonding

Vertically formed inductor and electronic device having the same

Transceiver module and optical bench for passive alignment

System for monitoring optical output/wavelength

Method of manufacturing a piezoelectric micro energy harvester

Method for optical module packaging of flip chip bonding

Electronic device including LTCC inductor

Method for fabricating a semiconductor package

Wavelength stabilization module having light-receiving element array and method of manufacturing the same

Optical module and optical module package

Optical module

Composition and methods of forming solder bump and flip chip using the same

Composition and methods of forming solder bump and flip chip using the same

Wafer level package and method of fabricating the same

EOM YONG SUNG

Method and structure for bonding flip chip

Composition and methods of forming solder bump and flip chip using the same

ELECTRONICS & TELECOMMUNICATIONS RES INST

Composition and methods of forming solder bump and flip chip using the same

Pattern-forming method for forming a conductive circuit pattern

HYUNDAI ELECTRONICS IND

Chip scale package

JUN CHI HOON

Piezoelectric micro energy harvester and manufacturing method thereof

BAE HYUN-CHEOL

Silicon interposer including backside inductor

MOON JONG TAE

Vacuum wafer level packaging method for micro electro mechanical system device