Inventor
CHANG JUI-HSIEN
TW17 patents
⚠️ This page may combine multiple inventors who share the name “CHANG JUI-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED CHIP ENG TECH INC
10 patentsUS7279782B2Oct 9, 2007
FBGA and COB package structure for image sensor
ADVANCED CHIP ENG TECH INC21 citations91
US7423335B2Sep 9, 2008
Sensor module package structure and method of the same
ADVANCED CHIP ENG TECH INC15 citations84
US7459729B2Dec 2, 2008
Semiconductor image device package with die receiving through-hole and method of the same
ADVANCED CHIP ENG TECH INC16 citations83
US7335870B1Feb 26, 2008
Method for image sensor protection
ADVANCED CHIP ENG TECH INC11 citations83
US7176567B2Feb 13, 2007
Semiconductor device protective structure and method for fabricating the same
ADVANCED CHIP ENG TECH INC10 citations80
US7566854B2Jul 28, 2009
Image sensor module
ADVANCED CHIP ENG TECH INC7 citations73
US7342296B2Mar 11, 2008
Wafer street buffer layer
ADVANCED CHIP ENG TECH INC8 citations73
US7525139B2Apr 28, 2009
Image sensor with a protection layer
ADVANCED CHIP ENG TECH INC7 citations71
US7416920B2Aug 26, 2008
Semiconductor device protective structure and method for fabricating the same
ADVANCED CHIP ENG TECH INC5 citations70
US7863105B2Jan 4, 2011
Image sensor package and forming method of the same
ADVANCED CHIP ENG TECH INC0 citations41
EPISTAR CORP
4 patentsUS9917075B2Mar 13, 2018
Light-emitting device and the method of manufacturing the same
EPISTAR CORP2 citations73
US11107797B2Aug 31, 2021
Light-emitting device and the method of manufacturing the same
EPISTAR CORP0 citations62
US10756067B2Aug 25, 2020
Light-emitting device and the method of manufacturing the same
EPISTAR CORP0 citations52
US10217904B2Feb 26, 2019
Light-emitting device with metallized mounting support structure
EPISTAR CORP0 citations37