Inventor
HSIAO HUANG-TING
TW5 patents
Patents
5 patentsUS9454684B2Sep 27, 2016
Edge crack detection system
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations81
US11018099B2May 25, 2021
Semiconductor structure having a conductive bump with a plurality of bump segments
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US9880220B2Jan 30, 2018
Edge crack detection system
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12568866B2Mar 3, 2026
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11495556B2Nov 8, 2022
Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60