P

Inventor

YOSHIDA EIJI

JP99 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIDA EIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

14 patents
US6824643B2Nov 30, 2004

Method and device of peeling semiconductor device using annular contact members

FUJITSU LTD85 citations98
US6388333B1May 14, 2002

Semiconductor device having protruding electrodes higher than a sealed portion

FUJITSU LTD285 citations97
US6750074B2Jun 15, 2004

Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig

FUJITSU LTD13 citations92
US6732911B2May 11, 2004

Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system

FUJITSU LTD35 citations92
US6563330B1May 13, 2003

Probe card and method of testing wafer having a plurality of semiconductor devices

FUJITSU LTD37 citations92
US6528348B2Mar 4, 2003

Semiconductor device having protruding electrodes higher than a sealed portion

FUJITSU LTD36 citations92
US6461942B2Oct 8, 2002

Semiconductor chip removing and conveying method and device

FUJITSU LTD24 citations90
US7395847B2Jul 8, 2008

Jig for a semiconductor substrate

FUJITSU LTD9 citations84
US7166882B2Jan 23, 2007

Semiconductor device and method for fabricating the same

FUJITSU LTD13 citations84
US7196418B2Mar 27, 2007

Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device

FUJITSU LTD14 citations83
US9614440B2Apr 4, 2017

Power supply device and semiconductor integrated circuit device

FUJITSU LTD6 citations73
US7109561B2Sep 19, 2006

Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig

FUJITSU LTD4 citations73
US6902944B2Jun 7, 2005

Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig

FUJITSU LTD5 citations73
US6774650B2Aug 10, 2004

Probe card and method of testing wafer having a plurality of semiconductor devices

FUJITSU LTD7 citations73

TOYOTA MOTOR CO LTD

5 patents

KONISHIROKU PHOTO IND

5 patents

NIPPON TELEGRAPH & TELEPHONE

4 patents

YOSHIDA EIJI

3 patents

ISHIHARA KOICHI

2 patents

KAWAKAMI HIROTO

2 patents

AMP INC

1 patent

FUJITSU SEMICONDUCTOR LTD

1 patent

FUJITSU MICROELECTRONICS LTD

1 patent

YAMAMOTO MASAKAZU

1 patent

MITSUMI ELECTRIC CO LTD

1 patent

NTT ELECTRONICS CORP

1 patent

NAT INST RADIOLOG

1 patent

TOKYO AUTOMATIC MACH WORKS

1 patent

INADAMA NAOKO

1 patent

NISHIO FUMIHIKO

1 patent

SHIBUYA KENGO

1 patent

TOSHIBA KK

1 patent

MITSUBISHI ELECTRIC CORP

1 patent

TEAC CORP

1 patent

ANDO ELECTRIC

1 patent

Showing the top 50 of 99 patents by PatentIndex Score.