P

Inventor

PAVONE SALVATORE FRANK

US24 patents
⚠️ This page may combine multiple inventors who share the name “PAVONE SALVATORE FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

23 patents
US10453817B1Oct 22, 2019

Zinc-cobalt barrier for interface in solder bond applications

TEXAS INSTRUMENTS INC7 citations83
US10692830B2Jun 23, 2020

Multilayers of nickel alloys as diffusion barrier layers

TEXAS INSTRUMENTS INC2 citations72
US12237219B2Feb 25, 2025

Contact with bronze material to mitigate undercut

TEXAS INSTRUMENTS INC0 citations62
US12068221B2Aug 20, 2024

Plating for thermal management

TEXAS INSTRUMENTS INC0 citations62
US11594504B2Feb 28, 2023

Nickel alloy for semiconductor packaging

TEXAS INSTRUMENTS INC0 citations62
US11587858B2Feb 21, 2023

Zinc-cobalt barrier for interface in solder bond applications

TEXAS INSTRUMENTS INC0 citations62
US11127515B2Sep 21, 2021

Nanostructure barrier for copper wire bonding

TEXAS INSTRUMENTS INC0 citations62
US11011483B2May 18, 2021

Nickel alloy for semiconductor packaging

TEXAS INSTRUMENTS INC0 citations62
US11011488B2May 18, 2021

Zinc-cobalt barrier for interface in solder bond applications

TEXAS INSTRUMENTS INC0 citations62
US10566267B2Feb 18, 2020

Die attach surface copper layer with protective layer for microelectronic devices

TEXAS INSTRUMENTS INC1 citations62
US11984418B2May 14, 2024

Method of forming brass-coated metals in flip-chip redistribution layers

TEXAS INSTRUMENTS INC0 citations61
US11410947B2Aug 9, 2022

Brass-coated metals in flip-chip redistribution layers

TEXAS INSTRUMENTS INC0 citations61
US11855024B2Dec 26, 2023

Wafer chip scale packages with visible solder fillets

TEXAS INSTRUMENTS INC0 citations59
US11443996B2Sep 13, 2022

Zinc layer for a semiconductor die pillar

TEXAS INSTRUMENTS INC0 citations57
US11362020B2Jun 14, 2022

Flipchip package with an IC having a covered cavity comprising metal posts

TEXAS INSTRUMENTS INC0 citations57
US11876065B2Jan 16, 2024

Flip chip package assembly

TEXAS INSTRUMENTS INC0 citations56
US11948871B2Apr 2, 2024

Process for thin film capacitor integration

TEXAS INSTRUMENTS INC0 citations51
US10796956B2Oct 6, 2020

Contact fabrication to mitigate undercut

TEXAS INSTRUMENTS INC0 citations51
US10734304B2Aug 4, 2020

Plating for thermal management

TEXAS INSTRUMENTS INC0 citations51
US10629334B2Apr 21, 2020

Nanostructure barrier for copper wire bonding

TEXAS INSTRUMENTS INC0 citations51
US7573086B2Aug 11, 2009

TaN integrated circuit (IC) capacitor

TEXAS INSTRUMENTS INC2 citations49
US12100678B2Sep 24, 2024

Conductive members for die attach in flip chip packages

TEXAS INSTRUMENTS INC0 citations48
US10424552B2Sep 24, 2019

Alloy diffusion barrier layer

TEXAS INSTRUMENTS INC0 citations41

NEW JASON JAMES

1 patent