Inventor
PAVONE SALVATORE FRANK
US24 patents
⚠️ This page may combine multiple inventors who share the name “PAVONE SALVATORE FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
23 patentsUS10453817B1Oct 22, 2019
Zinc-cobalt barrier for interface in solder bond applications
TEXAS INSTRUMENTS INC7 citations83
US10692830B2Jun 23, 2020
Multilayers of nickel alloys as diffusion barrier layers
TEXAS INSTRUMENTS INC2 citations72
US12237219B2Feb 25, 2025
Contact with bronze material to mitigate undercut
TEXAS INSTRUMENTS INC0 citations62
US12068221B2Aug 20, 2024
Plating for thermal management
TEXAS INSTRUMENTS INC0 citations62
US11594504B2Feb 28, 2023
Nickel alloy for semiconductor packaging
TEXAS INSTRUMENTS INC0 citations62
US11587858B2Feb 21, 2023
Zinc-cobalt barrier for interface in solder bond applications
TEXAS INSTRUMENTS INC0 citations62
US11127515B2Sep 21, 2021
Nanostructure barrier for copper wire bonding
TEXAS INSTRUMENTS INC0 citations62
US11011483B2May 18, 2021
Nickel alloy for semiconductor packaging
TEXAS INSTRUMENTS INC0 citations62
US11011488B2May 18, 2021
Zinc-cobalt barrier for interface in solder bond applications
TEXAS INSTRUMENTS INC0 citations62
US10566267B2Feb 18, 2020
Die attach surface copper layer with protective layer for microelectronic devices
TEXAS INSTRUMENTS INC1 citations62
US11984418B2May 14, 2024
Method of forming brass-coated metals in flip-chip redistribution layers
TEXAS INSTRUMENTS INC0 citations61
US11410947B2Aug 9, 2022
Brass-coated metals in flip-chip redistribution layers
TEXAS INSTRUMENTS INC0 citations61
US11855024B2Dec 26, 2023
Wafer chip scale packages with visible solder fillets
TEXAS INSTRUMENTS INC0 citations59
US11443996B2Sep 13, 2022
Zinc layer for a semiconductor die pillar
TEXAS INSTRUMENTS INC0 citations57
US11362020B2Jun 14, 2022
Flipchip package with an IC having a covered cavity comprising metal posts
TEXAS INSTRUMENTS INC0 citations57
US11876065B2Jan 16, 2024
Flip chip package assembly
TEXAS INSTRUMENTS INC0 citations56
US11948871B2Apr 2, 2024
Process for thin film capacitor integration
TEXAS INSTRUMENTS INC0 citations51
US10796956B2Oct 6, 2020
Contact fabrication to mitigate undercut
TEXAS INSTRUMENTS INC0 citations51
US10734304B2Aug 4, 2020
Plating for thermal management
TEXAS INSTRUMENTS INC0 citations51
US10629334B2Apr 21, 2020
Nanostructure barrier for copper wire bonding
TEXAS INSTRUMENTS INC0 citations51
US7573086B2Aug 11, 2009
TaN integrated circuit (IC) capacitor
TEXAS INSTRUMENTS INC2 citations49
US12100678B2Sep 24, 2024
Conductive members for die attach in flip chip packages
TEXAS INSTRUMENTS INC0 citations48
US10424552B2Sep 24, 2019
Alloy diffusion barrier layer
TEXAS INSTRUMENTS INC0 citations41