Inventor
HAGIMOTO YOSHIYA
JP39 patents
⚠️ This page may combine multiple inventors who share the name “HAGIMOTO YOSHIYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
24 patentsUS9147650B2Sep 29, 2015
Semiconductor device, method for manufacturing semiconductor device, and electronic apparatus
SONY CORP16 citations92
US9111763B2Aug 18, 2015
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP9 citations92
US10515988B2Dec 24, 2019
Solid-state image sensing device and electronic device
SONY CORP10 citations84
US10485293B2Nov 26, 2019
Semiconductor device and electronic apparatus with metal-containing film layer at bonding surface thereof
SONY CORP6 citations84
US10431621B2Oct 1, 2019
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP7 citations84
US10038024B2Jul 31, 2018
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP3 citations84
US9443802B2Sep 13, 2016
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP7 citations84
US9190275B2Nov 17, 2015
Bonding substrates with electrical connection through insulating film
SONY CORP5 citations84
US7994603B2Aug 9, 2011
Semiconductor device and a method of manufacturing the same
SONY CORP7 citations84
US10026769B2Jul 17, 2018
Semiconductor device and solid-state imaging device
SONY CORP12 citations83
US11107855B2Aug 31, 2021
Method for bonding and connecting substrates
SONY CORP1 citations73
US10985102B2Apr 20, 2021
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP2 citations73
US10707258B2Jul 7, 2020
Semiconductor device with multiple substrates electrically connected through an insulating film
SONY CORP1 citations73
US9911778B2Mar 6, 2018
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP2 citations73
US9716076B2Jul 25, 2017
Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereof
SONY CORP2 citations73
US9666627B2May 30, 2017
Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating film
SONY CORP2 citations73
US9362106B2Jun 7, 2016
Substrate processing method, substrate processing apparatus, and storage medium
SONY CORP4 citations70
US10134795B2Nov 20, 2018
Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing method
SONY CORP1 citations63
US11569123B2Jan 31, 2023
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP0 citations62
US11217612B2Jan 4, 2022
Solid-state image sensing device and electronic device
SONY CORP0 citations62
US10804313B2Oct 13, 2020
Semiconductor device and solid-state imaging device
SONY CORP1 citations62
US9941326B2Apr 10, 2018
Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate
SONY CORP0 citations52
US9263496B2Feb 16, 2016
Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate
SONY CORP0 citations52
US8367503B2Feb 5, 2013
Semiconductor device and a method of manufacturing the same
SONY CORP0 citations52
SONY SEMICONDUCTOR SOLUTIONS CORP
10 patentsUS11742374B2Aug 29, 2023
Semiconductor device, method of manufacturing semiconductor device, and imaging element
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations73
US11031431B2Jun 8, 2021
Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP5 citations73
US10753551B2Aug 25, 2020
Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate
SONY SEMICONDUCTOR SOLUTIONS CORP4 citations73
US11194135B2Dec 7, 2021
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations72
US10379323B2Aug 13, 2019
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations72
US12199123B2Jan 14, 2025
Semiconductor device including a structure for higher integration
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11525984B2Dec 13, 2022
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11329077B2May 10, 2022
Semiconductor device with a through electrode reception part wider than a through electrode, solid-state imaging device, and electronic equipment
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations62
US12324267B2Jun 3, 2025
Imaging device, electronic device, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations60
US10998300B2May 4, 2021
Display unit
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations52