Inventor

Guillon David

CH7 patents

⚠️ This page may combine multiple inventors who share the name “Guillon David”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ABB TECHNOLOGY AG

2 patents

US9949385B2Apr 17, 2018

Semiconductor module with ultrasonically welded terminals

ABB TECHNOLOGY AG3 citations64

US9975194B2May 22, 2018

Method for ultrasonic welding with particles trapping

ABB TECHNOLOGY AG0 citations41

HITACHI ENERGY LTD

2 patents

US12218192B2Feb 4, 2025

Metal substrate structure for a semiconductor power module

HITACHI ENERGY LTD0 citations53

US12094791B2Sep 17, 2024

Power semiconductor device with free-floating packaging concept

HITACHI ENERGY LTD0 citations46

ABB SCHWEIZ AG

2 patents

US9984948B2May 29, 2018

High voltage power electronics module for subsea applications under high hydrostatic pressure and temperature variations

ABB SCHWEIZ AG0 citations50

US10854524B2Dec 1, 2020

Power semiconductor module

ABB SCHWEIZ AG0 citations48

HITACHI ENERGY SWITZERLAND AG

1 patent

US11362008B2Jun 14, 2022

Power semiconductor module embedded in a mold compounded with an opening

HITACHI ENERGY SWITZERLAND AG0 citations47