Inventor
KAWASUMI MASAO
JP4 patents
Patents
4 patentsUS5350811ASep 27, 1994
Epoxy resin and adhesive composition containing the same
HITACHI CHEMICAL CO LTD32 citations91
US5258139ANov 2, 1993
Epoxy resin and adhesive composition containing the same
HITACHI CHEMICAL CO LTD7 citations72
US5188767AFeb 23, 1993
Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
HITACHI CHEMICAL CO LTD15 citations71
US6774501B2Aug 10, 2004
Resin-sealed semiconductor device, and die bonding material and sealing material for use therein
HITACHI CHEMICAL CO LTD6 citations61