Inventor
HYMES DIANE J
US20 patents
⚠️ This page may combine multiple inventors who share the name “HYMES DIANE J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
16 patentsUS6423200B1Jul 23, 2002
Copper interconnect seed layer treatment methods and apparatuses for treating the same
LAM RES CORP57 citations96
US6303551B1Oct 16, 2001
Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film
LAM RES CORP55 citations96
US6165956ADec 26, 2000
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP46 citations96
US6162301ADec 19, 2000
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP56 citations96
US6358847B1Mar 19, 2002
Method for enabling conventional wire bonding to copper-based bond pad features
LAM RES CORP48 citations94
US6593282B1Jul 15, 2003
Cleaning solutions for semiconductor substrates after polishing of copper film
LAM RES CORP21 citations92
US6294027B1Sep 25, 2001
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP26 citations92
US6610601B2Aug 26, 2003
Bond pad and wire bond
LAM RES CORP15 citations90
US6277203B1Aug 21, 2001
Method and apparatus for cleaning low K dielectric and metal wafer surfaces
LAM RES CORP43 citations90
US6319330B1Nov 20, 2001
Method and apparatus for cleaning low K dielectric and metal wafer surfaces
LAM RES CORP16 citations89
US6479443B1Nov 12, 2002
Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP15 citations84
US6324715B1Dec 4, 2001
Apparatus for cleaning semiconductor substrates
LAM RES CORP14 citations78
US6927198B2Aug 9, 2005
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP9 citations73
US6145148ANov 14, 2000
Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)
LAM RES CORP8 citations73
US7135098B2Nov 14, 2006
Copper interconnect seed layer treatment methods and apparatuses for treating the same
LAM RES CORP3 citations63
US6666326B2Dec 23, 2003
Reinforced chemical mechanical planarization belt
LAM RES CORP6 citations62