Inventor · disambiguated record
Kenichi Otake
Also filed as: OTAKE KENICHI
5 granted patents·2 pending applications·568 citations·filing 1996–2023
85Inventor score
Top patents by PatentIndex Score
7 records- 0195US5839187AApparatus and method for mounting a chipMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Nov 24, 1998·290 cites·8 claims
- 0294US5805422ASemiconductor package with flexible board and method of fabricating the sameNEC CORP·Filed 1997·Granted Sep 8, 1998·214 cites·10 claims
- 0376US6078123AStructure and method for mounting a saw deviceNEC CORP·Filed 1998·Granted Jun 20, 2000·51 cites·12 claims
- 0462US2025186971A1Metal organic frameworkUNIV KYOTO·Filed 2023·Application pending·0 cites
- 0561US2025186970A1Metal organic frameworkUNIV KYOTO·Filed 2023·Application pending·0 cites
- 0660US6497354B2Bonding apparatus and bonding tool for componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 24, 2002·8 cites·20 claims
- 0754US6543669B2Bonding apparatus and bonding tool for componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 8, 2003·5 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →