Inventor
LEHMAN JR STEPHEN E
US14 patents
⚠️ This page may combine multiple inventors who share the name “LEHMAN JR STEPHEN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS7700476B2Apr 20, 2010
Solder joint reliability in microelectronic packaging
INTEL CORP15 citations91
US7351784B2Apr 1, 2008
Chip-packaging composition of resin and cycloaliphatic amine hardener
INTEL CORP27 citations91
US7534649B2May 19, 2009
Thermoset polyimides for microelectronic applications
INTEL CORP5 citations73
US7314778B2Jan 1, 2008
Wafer-level processing of chip-packaging compositions including bis-maleimides
INTEL CORP8 citations73
US8009442B2Aug 30, 2011
Directing the flow of underfill materials using magnetic particles
INTEL CORP6 citations62
US7224050B2May 29, 2007
Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging
INTEL CORP3 citations62
US7579046B2Aug 25, 2009
Smart curing with a catalyst-functionalized surface
INTEL CORP2 citations61
US7217600B2May 15, 2007
Cyclic olefin polymers and catalyst for semiconductor applications
INTEL CORP4 citations61
US8018063B2Sep 13, 2011
Solder joint reliability in microelectronic packaging
INTEL CORP0 citations51
EXXONMOBIL RES & ENG CO
2 patentsUS7504465B2Mar 17, 2009
Linear functional copolymers of ethylene with precise and minimum run length distributions and methods of making thereof
EXXONMOBIL RES & ENG CO2 citations62
US7402642B2Jul 22, 2008
Linear functional copolymers of ethylene with precise and minimum run length distributions and method of making thereof
EXXONMOBIL RES & ENG CO2 citations62