Inventor
BAEK HYUNG-GIL
KR14 patents
Patents
14 patentsUS10008462B2Jun 26, 2018
Semiconductor package
SAMSUNG ELECTRONICS CO LTD12 citations84
US7880291B2Feb 1, 2011
Integrated circuit package and integrated circuit module
SAMSUNG ELECTRONICS CO LTD9 citations84
US7642636B2Jan 5, 2010
Stack package of ball grid array type
SAMSUNG ELECTRONICS CO LTD17 citations83
US10304781B2May 28, 2019
Semiconductor devices including guard ring and crack sensing circuit
SAMSUNG ELECTRONICS CO LTD7 citations82
US9775230B2Sep 26, 2017
Printed circuit board and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD4 citations72
US7649248B2Jan 19, 2010
Stack package implementing conductive support
SAMSUNG ELECTRONICS CO LTD7 citations72
US10490514B2Nov 26, 2019
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations71
US10103109B2Oct 16, 2018
Semiconductor device, semiconductor chip and method of manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US9984945B2May 29, 2018
Semiconductor chip
SAMSUNG ELECTRONICS CO LTD2 citations71
US11862570B2Jan 2, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11450614B2Sep 20, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US7812445B2Oct 12, 2010
Semiconductor memory module having an oblique memory chip
SAMSUNG ELECTRONICS CO LTD2 citations61
US10643958B2May 5, 2020
Semiconductor device, semiconductor chip and method of manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations60
US12051680B2Jul 30, 2024
Semiconductor package aligning interposer and substrate
SAMSUNG ELECTRONICS CO LTD0 citations48