Inventor
FOONG SALLY
US10 patents
⚠️ This page may combine multiple inventors who share the name “FOONG SALLY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SPANSION LLC
8 patentsUS8357563B2Jan 22, 2013
Stitch bump stacking design for overall package size reduction for multiple stack
SPANSION LLC5 citations65
US7674653B2Mar 9, 2010
Die offset die to bonding
SPANSION LLC2 citations57
US9196608B2Nov 24, 2015
Method of chip positioning for multi-chip packaging
SPANSION LLC2 citations55
US7932131B2Apr 26, 2011
Reduction of package height in a stacked die configuration
SPANSION LLC4 citations54
US7750481B2Jul 6, 2010
Die offset die to die bonding
SPANSION LLC0 citations46
US7554204B2Jun 30, 2009
Die offset die to die bonding
SPANSION LLC0 citations46
US8901756B2Dec 2, 2014
Chip positioning in multi-chip package
SPANSION LLC0 citations44
US7799612B2Sep 21, 2010
Process applying die attach film to singulated die
SPANSION LLC0 citations38