P

Inventor

CHIN LAI NGUK

MY6 patents
⚠️ This page may combine multiple inventors who share the name “CHIN LAI NGUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SPANSION LLC

4 patents
US8357563B2Jan 22, 2013

Stitch bump stacking design for overall package size reduction for multiple stack

SPANSION LLC5 citations65
US9196608B2Nov 24, 2015

Method of chip positioning for multi-chip packaging

SPANSION LLC2 citations55
US7932131B2Apr 26, 2011

Reduction of package height in a stacked die configuration

SPANSION LLC4 citations54
US8901756B2Dec 2, 2014

Chip positioning in multi-chip package

SPANSION LLC0 citations44

CYPRESS SEMICONDUCTOR CORP

1 patent
US9679831B2Jun 13, 2017

Tape chip on lead using paste die attach material

CYPRESS SEMICONDUCTOR CORP0 citations43

CHIN LAI NGUK

1 patent
US8680686B2Mar 25, 2014

Method and system for thin multi chip stack package with film on wire and copper wire

CHIN LAI NGUK0 citations26