Inventor
LIAO YI-CHIAN
TW7 patents
Patents
7 patentsUS11164755B1Nov 2, 2021
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US11418002B2Aug 16, 2022
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US9548220B2Jan 17, 2017
Method of fabricating semiconductor package having an interposer structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9418874B2Aug 16, 2016
Method of fabricating semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9257381B2Feb 9, 2016
Semiconductor package, and interposer structure of the semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9087780B2Jul 21, 2015
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US8829687B2Sep 9, 2014
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49