Inventor
SANKMAN ROBERT
US31 patents
⚠️ This page may combine multiple inventors who share the name “SANKMAN ROBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
30 patentsUS7212405B2May 1, 2007
Method and apparatus for providing distributed fluid flows in a thermal management arrangement
INTEL CORP28 citations92
US6493223B1Dec 10, 2002
Computer utilizing refrigeration for cooling
INTEL CORP27 citations92
US11557541B2Jan 17, 2023
Interconnect architecture with silicon interposer and EMIB
INTEL CORP6 citations85
US11652020B2May 16, 2023
Thermal solutions for multi-package assemblies and methods for fabricating the same
INTEL CORP4 citations75
US11915996B2Feb 27, 2024
Microelectronics assembly including top and bottom packages in stacked configuration with shared cooling
INTEL CORP2 citations73
US11581287B2Feb 14, 2023
Chip scale thin 3D die stacked package
INTEL CORP2 citations73
US11515232B2Nov 29, 2022
Liquid cooling through conductive interconnect
INTEL CORP3 citations73
US10601426B1Mar 24, 2020
Programmable logic device with fine-grained disaggregation
INTEL CORP2 citations73
US11824018B2Nov 21, 2023
Heterogeneous nested interposer package for IC chips
INTEL CORP3 citations72
US11735533B2Aug 22, 2023
Heterogeneous nested interposer package for IC chips
INTEL CORP2 citations72
US11756860B2Sep 12, 2023
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP3 citations71
US12347783B2Jul 1, 2025
Interconnect architecture with silicon interposer and EMIB
INTEL CORP0 citations62
US12206410B2Jan 21, 2025
Programmable logic device with fine-grained disaggregation
INTEL CORP0 citations62
US12148703B2Nov 19, 2024
EMIB patch on glass laminate substrate
INTEL CORP0 citations62
US11901299B2Feb 13, 2024
Interconnect architecture with silicon interposer and EMIB
INTEL CORP0 citations62
US11658122B2May 23, 2023
EMIB patch on glass laminate substrate
INTEL CORP0 citations62
US11652057B2May 16, 2023
Disaggregated die interconnection with on-silicon cavity bridge
INTEL CORP0 citations62
US11595045B2Feb 28, 2023
Programmable logic device with fine-grained disaggregation
INTEL CORP0 citations62
US11070209B2Jul 20, 2021
Programmable logic device with fine-grained disaggregation
INTEL CORP0 citations62
US10396046B2Aug 27, 2019
Substrate assembly with magnetic feature
INTEL CORP1 citations62
US12341080B2Jun 24, 2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP0 citations61
US12272656B2Apr 8, 2025
Heterogeneous nested interposer package for IC chips
INTEL CORP0 citations61
US12199048B2Jan 14, 2025
Heterogeneous nested interposer package for IC chips
INTEL CORP0 citations61
US11978689B2May 7, 2024
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP0 citations61
US12003023B2Jun 4, 2024
In-package 3D antenna
INTEL CORP0 citations59
US11978727B2May 7, 2024
Package on active silicon semiconductor packages
INTEL CORP0 citations52
US11610856B2Mar 21, 2023
Connectivity between integrated circuit dice in a multi-chip package
INTEL CORP0 citations52
US10765046B2Sep 1, 2020
Electromagnetic interference shields for electronic packages and related methods
INTEL CORP0 citations52
US10264717B2Apr 16, 2019
Electromagnetic interference shields for electronic packages and related methods
INTEL CORP0 citations52
US9918414B2Mar 13, 2018
Electromagnetic interference shields for electronic packages and related methods
INTEL CORP0 citations52