P

Inventor

SANKMAN ROBERT

US31 patents
⚠️ This page may combine multiple inventors who share the name “SANKMAN ROBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

30 patents
US7212405B2May 1, 2007

Method and apparatus for providing distributed fluid flows in a thermal management arrangement

INTEL CORP28 citations92
US6493223B1Dec 10, 2002

Computer utilizing refrigeration for cooling

INTEL CORP27 citations92
US11557541B2Jan 17, 2023

Interconnect architecture with silicon interposer and EMIB

INTEL CORP6 citations85
US11652020B2May 16, 2023

Thermal solutions for multi-package assemblies and methods for fabricating the same

INTEL CORP4 citations75
US11915996B2Feb 27, 2024

Microelectronics assembly including top and bottom packages in stacked configuration with shared cooling

INTEL CORP2 citations73
US11581287B2Feb 14, 2023

Chip scale thin 3D die stacked package

INTEL CORP2 citations73
US11515232B2Nov 29, 2022

Liquid cooling through conductive interconnect

INTEL CORP3 citations73
US10601426B1Mar 24, 2020

Programmable logic device with fine-grained disaggregation

INTEL CORP2 citations73
US11824018B2Nov 21, 2023

Heterogeneous nested interposer package for IC chips

INTEL CORP3 citations72
US11735533B2Aug 22, 2023

Heterogeneous nested interposer package for IC chips

INTEL CORP2 citations72
US11756860B2Sep 12, 2023

Semiconductor device stack-up with bulk substrate material to mitigate hot spots

INTEL CORP3 citations71
US12347783B2Jul 1, 2025

Interconnect architecture with silicon interposer and EMIB

INTEL CORP0 citations62
US12206410B2Jan 21, 2025

Programmable logic device with fine-grained disaggregation

INTEL CORP0 citations62
US12148703B2Nov 19, 2024

EMIB patch on glass laminate substrate

INTEL CORP0 citations62
US11901299B2Feb 13, 2024

Interconnect architecture with silicon interposer and EMIB

INTEL CORP0 citations62
US11658122B2May 23, 2023

EMIB patch on glass laminate substrate

INTEL CORP0 citations62
US11652057B2May 16, 2023

Disaggregated die interconnection with on-silicon cavity bridge

INTEL CORP0 citations62
US11595045B2Feb 28, 2023

Programmable logic device with fine-grained disaggregation

INTEL CORP0 citations62
US11070209B2Jul 20, 2021

Programmable logic device with fine-grained disaggregation

INTEL CORP0 citations62
US10396046B2Aug 27, 2019

Substrate assembly with magnetic feature

INTEL CORP1 citations62
US12341080B2Jun 24, 2025

Semiconductor device stack-up with bulk substrate material to mitigate hot spots

INTEL CORP0 citations61
US12272656B2Apr 8, 2025

Heterogeneous nested interposer package for IC chips

INTEL CORP0 citations61
US12199048B2Jan 14, 2025

Heterogeneous nested interposer package for IC chips

INTEL CORP0 citations61
US11978689B2May 7, 2024

Semiconductor device stack-up with bulk substrate material to mitigate hot spots

INTEL CORP0 citations61
US12003023B2Jun 4, 2024

In-package 3D antenna

INTEL CORP0 citations59
US11978727B2May 7, 2024

Package on active silicon semiconductor packages

INTEL CORP0 citations52
US11610856B2Mar 21, 2023

Connectivity between integrated circuit dice in a multi-chip package

INTEL CORP0 citations52
US10765046B2Sep 1, 2020

Electromagnetic interference shields for electronic packages and related methods

INTEL CORP0 citations52
US10264717B2Apr 16, 2019

Electromagnetic interference shields for electronic packages and related methods

INTEL CORP0 citations52
US9918414B2Mar 13, 2018

Electromagnetic interference shields for electronic packages and related methods

INTEL CORP0 citations52

MA QING

1 patent