Inventor

TANAKA TAKEHIKO

JP146 patents

⚠️ This page may combine multiple inventors who share the name “TANAKA TAKEHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANAKA TAKEHIKO

NINGBO SUNNY OPOTECH CO LTD

Camera module and array camera module based on integral packaging technology

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module and array camera module based on integral packaging technology

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module based on integral packaging technology

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module and array camera module based on integral packaging technology

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and molded circuit board assembly and manufacturing method thereof

Camera module and molded circuit board assembly and manufacturing method thereof

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Manufacturing method of molded photosensitive assembly for electronic device

Camera module and manufacturing method thereof

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module

Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Array camera module and application thereof

Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board

Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof

Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Molded photosensitive assembly for array imaging module for electronic device

Camera module and manufacturing method thereof

Photosensitive assembly and camera module and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

FUJITSU LTD

Neuroprocessing service

Betting tickets selling and collecting system

Apparatus for processing betting tickets

Data processing device in a virtual memory having a paging function

SONY CORP

Error monitoring system for video/audio devices

TOSHIBA KK

Mobile communication terminal

YAMADA KENJI

Moveable in-vehicle apparatus operable by multiple users

KATOU TAKASHI

Method of manufacturing waterproof intermediate spliced portion of wires and waterproof intermediate unit of wires