Inventor · disambiguated record
Koji Honna
Also filed as: HONNA KOJI
3 granted patents·1 pending application·117 citations·filing 1998–2001
76Inventor score
Technology areasH10W
Files withFUJITSU LTD4
Top patents by PatentIndex Score
4 records- 0177US6166433AResin molded semiconductor device and method of manufacturing semiconductor packageFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·59 cites·16 claims
- 0276US6291895B1Method of fabricating semiconductor having through holeFUJITSU LTD·Filed 1999·Granted Sep 18, 2001·40 cites·5 claims
- 0357US5953592AMethod of fabricating semiconductor having through holeFUJITSU LTD·Filed 1998·Granted Sep 14, 1999·18 cites·8 claims
- 0437US2001028101A1Method of fabricating semiconductor having through holeFUJITSU LTD·Filed 2001·Application pending·0 cites
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