Inventor · disambiguated record
Hirofumi Shinagawa
Also filed as: SHINAGAWA HIROFUMI
12 granted patents·3 citations·filing 2015–2018
81Inventor score
Files withMURATA MANUFACTURING CO12
Top patents by PatentIndex Score
12 records- 0173US9974185B2Component-embedded substrateMURATA MANUFACTURING CO·Filed 2016·Granted May 15, 2018·2 cites·18 claims
- 0264US10338031B2Component-embedded substrate and substrate flaw detecting methodMURATA MANUFACTURING CO·Filed 2017·Granted Jul 2, 2019·1 cites·20 claims
- 0356US10219367B2Multilayer resin substrate, and method of manufacturing multilayer resin substrateMURATA MANUFACTURING CO·Filed 2017·Granted Feb 26, 2019·0 cites·8 claims
- 0453US9986139B2Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including sameMURATA MANUFACTURING CO·Filed 2017·Granted May 29, 2018·0 cites·23 claims
- 0552US9848489B2Multilayer resin substrate, and method of manufacturing multilayer resin substrateMURATA MANUFACTURING CO·Filed 2015·Granted Dec 19, 2017·0 cites·8 claims
- 0649US9813595B2Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including sameMURATA MANUFACTURING CO·Filed 2015·Granted Nov 7, 2017·0 cites·20 claims
- 0748US9854677B2Module componentMURATA MANUFACTURING CO·Filed 2016·Granted Dec 26, 2017·0 cites·19 claims
- 0847US9961780B2Method for manufacturing resin multilayer boardMURATA MANUFACTURING CO·Filed 2015·Granted May 1, 2018·0 cites·16 claims
- 0946US10741462B2Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrateMURATA MANUFACTURING CO·Filed 2018·Granted Aug 11, 2020·0 cites·15 claims
- 1044US10231342B2Component built-in substrateMURATA MANUFACTURING CO·Filed 2017·Granted Mar 12, 2019·0 cites·15 claims
- 1144US9922918B2Substrate for stacked module, stacked module, and method for manufacturing stacked moduleMURATA MANUFACTURING CO·Filed 2017·Granted Mar 20, 2018·0 cites·17 claims
- 1237US9629249B2Component-embedded substrate and communication moduleMURATA MANUFACTURING CO·Filed 2015·Granted Apr 18, 2017·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →