Inventor

BOYD JOHN

CA51 patents

⚠️ This page may combine multiple inventors who share the name “BOYD JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOYD JOHN

LAM RES CORP

Apparatus and method for providing a confined liquid for immersion lithography

Methods of post-contact back end of the line through-hole via integration

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition

Pressurized membrane platen design for improving performance in CMP applications

Interlocking chemical mechanical polishing system

Methods for providing a confined liquid for immersion lithography

Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor

Electroplating head and method for operating the same

Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency

Methods using active retainer rings for improving edge performance in CMP applications

Platen design for improving edge performance in CMP applications

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

Methods and systems for low interfacial oxide contact between barrier and copper metallization

Semiconductor wafer material removal apparatus and method for operating the same

Method for electroless depositing a material on a surface of a wafer

Thermal methods for cleaning post-CMP wafers

Methods and systems for barrier layer surface passivation

Methods and systems for low interfacial oxide contact between barrier and copper metallization

Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency

Method and apparatus for plating semiconductor wafers

Thermal methods for cleaning post-CMP wafers

Method and apparatus for plating semiconductor wafers

Method and apparatus for semiconductor wafer planarization

Method and apparatus for semiconductor wafer planarization

Method and apparatus for material deposition in semiconductor fabrication

BOYD JOHN

Computer-based methods and systems for arranging meetings between users and methods and systems for verifying background information of users

Controlled ambient system for interface engineering

Methods and apparatuses for three dimensional integrated circuits

Device with post-contact back end of line through-hole via integration

Methods of post-contact back end of line through-hole via integration

Location-based networking methods and systems for performing the same

Modular ultra-wide internal bus mainframe processing units

Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal

DORDI YEZDI

Processes and systems for engineering a copper surface for selective metal deposition

Processes and systems for engineering a barrier surface for copper deposition

Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide

Method and apparatus for material deposition

Methods and systems for barrier layer surface passivation

Electroplating head and method for operating the same

COCA COLA CO

Remote beverage selection with a beverage dispenser

System and method for choosing and pouring beverages

System and method for choosing and pouring beverages

Vending mechanism

VIGNETTE CORP

Method and system for native-byte form handling

Method and system for native-byte form handling

YOON HYUNGSUK ALEXANDER

Method for barrier interface preparation of copper interconnect

Apparatus for the removal of a fluorinated polymer from a substrate

ADVANCED MATERIALS SCIENCES IN

Protecting thin semiconductor wafers during back-grinding in high-volume production

HANCOCK ROBERT E W

Diagnostic for sepsis