Inventor · disambiguated record
Shigeki Kondoh
Also filed as: KONDOH Shigeki
4 granted patents·3 pending applications·3 citations·filing 2019–2023
60Inventor score
Files withSENJU METAL INDUSTRY CO7
Top patents by PatentIndex Score
7 records- 0184US11495566B2Core material, electronic component and method for forming bump electrodeSENJU METAL INDUSTRY CO·Filed 2021·Granted Nov 8, 2022·1 cites·7 claims
- 0273US10639749B2Cu core ball, solder joint, solder paste and formed solderSENJU METAL INDUSTRY CO·Filed 2019·Granted May 5, 2020·2 cites·16 claims
- 0369US2024100635A1Core material, electronic component and method for forming bump electrodeSENJU METAL INDUSTRY CO·Filed 2023·Application pending·0 cites
- 0459US11872656B2Core material, electronic component and method for forming bump electrodeSENJU METAL INDUSTRY CO·Filed 2020·Granted Jan 16, 2024·0 cites·4 claims
- 0553US2023094946A1Metal Body, Fitting Connection Terminal, and Method for Forming Metal BodySENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 0648US10888959B2Cu core ball, solder joint, solder paste and formed solderSENJU METAL INDUSTRY CO·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 0740US2019376161A1Cu Core Ball, Solder Joint, Solder Paste and Formed SolderSENJU METAL INDUSTRY CO·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →