Inventor
SOUMA DAISUKE
JP6 patents
⚠️ This page may combine multiple inventors who share the name “SOUMA DAISUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SENJU METAL INDUSTRY CO
5 patentsUS7282175B2Oct 16, 2007
Lead-free solder
SENJU METAL INDUSTRY CO32 citations91
US7750475B2Jul 6, 2010
Lead-free solder ball
SENJU METAL INDUSTRY CO7 citations68
US11478869B2Oct 25, 2022
Method for forming bump electrode substrate
SENJU METAL INDUSTRY CO0 citations61
US11495566B2Nov 8, 2022
Core material, electronic component and method for forming bump electrode
SENJU METAL INDUSTRY CO1 citations60
US11872656B2Jan 16, 2024
Core material, electronic component and method for forming bump electrode
SENJU METAL INDUSTRY CO0 citations49