Inventor · disambiguated record
Shigeto Fukatsu
Also filed as: FUKATSU SHIGETO
11 granted patents·2 pending applications·10 citations·filing 2007–2022
81Inventor score
Top patents by PatentIndex Score
13 records- 0185US8665639B2Magnetoresistive element and magnetic memoryNAGASE TOSHIHIKO·Filed 2012·Granted Mar 4, 2014·7 cites·20 claims
- 0274US10373833B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2016·Granted Aug 6, 2019·2 cites·24 claims
- 0361US12477809B2Semiconductor device and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2022·Granted Nov 18, 2025·0 cites·9 claims
- 0460US11728386B2Semiconductor deviceTOSHIBA KK·Filed 2021·Granted Aug 15, 2023·0 cites·2 claims
- 0556US7749919B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2007·Granted Jul 6, 2010·1 cites·20 claims
- 0655US11094786B2Semiconductor deviceTOSHIBA KK·Filed 2020·Granted Aug 17, 2021·0 cites·18 claims
- 0752US2023084127A1Semiconductor device manufacturing methodTOSHIBA KK·Filed 2022·Application pending·0 cites
- 0849US10892332B2Gate insulating layer having a plurality of silicon oxide layer with varying thicknessTOSHIBA KK·Filed 2019·Granted Jan 12, 2021·0 cites·11 claims
- 0948US10714610B2Semiconductor device, method for manufacturing semiconductor device, inverter circuit, driving device, vehicle, and elevatorTOSHIBA KK·Filed 2018·Granted Jul 14, 2020·0 cites·23 claims
- 1045US10741395B2Method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2018·Granted Aug 11, 2020·0 cites·11 claims
- 1145US9196822B2Magnetoresistive effect elementTOSHIBA KK·Filed 2013·Granted Nov 24, 2015·0 cites·3 claims
- 1238US2010250223A1Semiconductor circuit deterioration simulation method and computer program mediumTOSHIBA KK·Filed 2010·Application pending·0 cites
- 1330US8476718B2Semiconductor device including a gate insulating film having a metal oxide layer having trap levelsHIRANO IZUMI·Filed 2010·Granted Jul 2, 2013·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →