Inventor · disambiguated record
Tatsuo Kawata
Also filed as: KAWATA TATSUO
5 granted patents·48 citations·filing 1988–2001
79Inventor score
Top patents by PatentIndex Score
5 records- 0168US6284818B1Encapsulant composition and electronic deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Sep 4, 2001·18 cites·6 claims
- 0263US6774501B2Resin-sealed semiconductor device, and die bonding material and sealing material for use thereinHITACHI CHEMICAL CO LTD·Filed 2001·Granted Aug 10, 2004·6 cites·24 claims
- 0363US4965657AResin encapsulated semiconductor deviceHITACHI LTD·Filed 1988·Granted Oct 23, 1990·13 cites·12 claims
- 0433US6211277B1Encapsulating material and LOC structure semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Apr 3, 2001·7 cites·13 claims
- 0529US5567990AResin-encapsulated semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Oct 22, 1996·4 cites·4 claims
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