Inventor
KUNG LING-CHEN
TW8 patents
⚠️ This page may combine multiple inventors who share the name “KUNG LING-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
6 patentsUS6277669B1Aug 21, 2001
Wafer level packaging method and packages formed
IND TECH RES INST274 citations98
US6268114B1Jul 31, 2001
Method for forming fine-pitched solder bumps
IND TECH RES INST97 citations97
US6197613B1Mar 6, 2001
Wafer level packaging method and devices formed
IND TECH RES INST156 citations97
US6539624B1Apr 1, 2003
Method for forming wafer level package
IND TECH RES INST31 citations92
US6440836B1Aug 27, 2002
Method for forming solder bumps on flip chips and devices formed
IND TECH RES INST33 citations91
US6179200B1Jan 30, 2001
Method for forming solder bumps of improved height and devices formed
IND TECH RES INST35 citations91