Inventor · disambiguated record
Hisashi Mashiyama
Also filed as: MASHIYAMA HISASHI
2 granted patents·1 pending application·51 citations·filing 2005–2012
60Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0191US7267604B2Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication methodHITACHI CABLE·Filed 2005·Granted Sep 11, 2007·49 cites·17 claims
- 0257US8796820B2Semiconductor wafer and semiconductor device waferNEMOTO SHUSEI·Filed 2012·Granted Aug 5, 2014·2 cites·17 claims
- 0337US2006185688A1Semiconductor wafer cleaning method and wafer cleaned by same methodHITACHI CABLE·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →