Inventor

WU JYUN-RU

TW6 patents

⚠️ This page may combine multiple inventors who share the name “WU JYUN-RU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

5 patents

US11018176B2May 25, 2021

Metal shielding layer in backside illumination image sensor chips and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

US9620555B2Apr 11, 2017

Metal shielding layer in backside illumination image sensor chips and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60

US10879629B2Dec 29, 2020

Method of electroplating metal into recessed feature and electroplating layer in recessed feature

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

US10749278B2Aug 18, 2020

Method of electroplating metal into recessed feature and electroplating layer in recessed feature

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

US10276621B2Apr 30, 2019

Metal shielding layer in backside illumination image sensor chips and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

CHANG SHIH-CHIEH

1 patent

US9224773B2Dec 29, 2015

Metal shielding layer in backside illumination image sensor chips and methods for forming the same

CHANG SHIH-CHIEH1 citations60