Inventor

HO PAUL KWOK KEUNG

SG21 patents

⚠️ This page may combine multiple inventors who share the name “HO PAUL KWOK KEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HO PAUL KWOK KEUNG

CHARTERED SEMICONDUCTOR MFG

Method to create a copper diffusion deterrent interface

Method to avoid copper contamination during copper etching and CMP

Method to create a controllable and reproducible dual copper damascene structure

Method to create a copper dual damascene structure with less dishing and erosion

Method to deposit a copper seed layer for dual damascene interconnects

Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding

Method of manufacturing embedded organic stop layer for dual damascene patterning

Method to create copper traps by modifying treatment on the dielectrics surface

Chlorine containing plasma etch method with enhanced sidewall passivation and attenuated microloading effect

Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate

Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes

Method to deposit a copper layer

Copper diffusion deterrent interface

Apparatus and methods to clean copper contamination on wafer edge

Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence

Method to deposit a cooper seed layer for dual damascence interconnects

Method of copper transport prevention by a sputtered gettering layer on backside of wafer

Method to reduce microloading in metal etching

NANO & ADVANCED MATERIALS INST LTD

Method for forming perovskite solar cell with printable carbon electrode

Conductive and photosensitive polymers

Non-vacuum method of manufacturing light-absorbing materials for solar cell application