Inventor
ELIASHEVICH IVAN
US25 patents
⚠️ This page may combine multiple inventors who share the name “ELIASHEVICH IVAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GELCORE LLC
9 patentsUS6964877B2Nov 15, 2005
LED power package
GELCORE LLC249 citations96
US7179670B2Feb 20, 2007
Flip-chip light emitting diode device without sub-mount
GELCORE LLC84 citations95
US6787435B2Sep 7, 2004
GaN LED with solderable backside metal
GELCORE LLC57 citations95
US6661167B2Dec 9, 2003
LED devices
GELCORE LLC60 citations95
US7190005B2Mar 13, 2007
GaN LED with solderable backside metal
GELCORE LLC19 citations92
US7064356B2Jun 20, 2006
Flip chip light emitting diode with micromesas and a conductive mesh
GELCORE LLC46 citations92
US7015516B2Mar 21, 2006
Led packages having improved light extraction
GELCORE LLC38 citations92
US7087463B2Aug 8, 2006
Laser separation of encapsulated submount
GELCORE LLC17 citations84
US7078319B2Jul 18, 2006
Laser separated die with tapered sidewalls for improved light extraction
GELCORE LLC13 citations83
EMCORE CORP
9 patentsUS6902990B2Jun 7, 2005
Semiconductor device separation using a patterned laser projection
EMCORE CORP77 citations96
US6849524B2Feb 1, 2005
Semiconductor wafer protection and cleaning for device separation using laser ablation
EMCORE CORP56 citations95
US6746889B1Jun 8, 2004
Optoelectronic device with improved light extraction
EMCORE CORP181 citations95
US6413839B1Jul 2, 2002
Semiconductor device separation using a patterned laser projection
EMCORE CORP129 citations95
US6958498B2Oct 25, 2005
Optimized contact design for flip-chip LED
EMCORE CORP88 citations94
US7115896B2Oct 3, 2006
Semiconductor structures for gallium nitride-based devices
EMCORE CORP55 citations93
US7023022B2Apr 4, 2006
Microelectronic package having improved light extraction
EMCORE CORP37 citations92
US6642548B1Nov 4, 2003
Light-emitting diodes with loop and strip electrodes and with wide medial sections
EMCORE CORP23 citations92
US6653215B1Nov 25, 2003
Contact to n-GaN with Au termination
EMCORE CORP19 citations89
LUMINATION LLC
6 patentsUS7285801B2Oct 23, 2007
LED with series-connected monolithically integrated mesas
LUMINATION LLC227 citations98
US7456035B2Nov 25, 2008
Flip chip light emitting diode devices having thinned or removed substrates
LUMINATION LLC39 citations92
US7358539B2Apr 15, 2008
Flip-chip light emitting diode with indium-tin-oxide based reflecting contacts
LUMINATION LLC21 citations92
US7842547B2Nov 30, 2010
Laser lift-off of sapphire from a nitride flip-chip
LUMINATION LLC21 citations91
US7635869B2Dec 22, 2009
Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip
LUMINATION LLC2 citations62
US7667236B2Feb 23, 2010
Optimized contact design for thermosonic bonding of flip-chip devices
LUMINATION LLC3 citations60