Inventor · disambiguated record
Hiroshi Horibe
Also filed as: HORIBE HIROSHI
14 granted patents·3 pending applications·74 citations·filing 1997–2018
90Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP4RENESAS TECH CORP4RENESAS ELECTRONICS CORP3MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2MITSUBISHI DENKI KABUSHKI KAIS1
Top patents by PatentIndex Score
17 records- 0183US10978420B2Semiconductor chip mounting apparatus and semiconductor chip mounting methodSHINKAWA KK·Filed 2018·Granted Apr 13, 2021·4 cites·20 claims
- 0274US7202565B2Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 10, 2007·19 cites·10 claims
- 0369US8686573B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 1, 2014·2 cites·24 claims
- 0458US6518652B2Semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Feb 11, 2003·10 cites·6 claims
- 0553US9230930B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jan 5, 2016·0 cites·5 claims
- 0651US6787927B2Semiconductor device and wire bonding apparatusRENESAS TECH CORP·Filed 2002·Granted Sep 7, 2004·4 cites·5 claims
- 0749US9368463B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 14, 2016·0 cites·16 claims
- 0849US9230937B2Semiconductor device and a manufacturing method thereofSUMITOMO KAORI·Filed 2012·Granted Jan 5, 2016·1 cites·13 claims
- 0949US6105848AWire bonding method, wire bonding apparatus and semiconductor device produced by the sameMITSUBISHI DENKI KABUSHKI KAIS·Filed 1998·Granted Aug 22, 2000·14 cites·6 claims
- 1048US2007145583A1Semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 1144US6112969AWire bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Sep 5, 2000·11 cites·1 claims
- 1241US5838071AWire bonding method, wire bonding apparatus and semiconductor device produced by the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 17, 1998·9 cites·4 claims
- 1340US2005029679A1Semiconductor device and wire bonding apparatusRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 1438US7138725B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Nov 21, 2006·0 cites·5 claims
- 1535US6600218B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 29, 2003·0 cites·17 claims
- 1633US2004262723A1Semiconductor deviceRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 1728US8415245B2Method of manufacturing semiconductor device and semiconductor deviceTAKATA YASUKI·Filed 2010·Granted Apr 9, 2013·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →