Inventor
LING YUNZHI
CN4 patents
⚠️ This page may combine multiple inventors who share the name “LING YUNZHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES
3 patentsUS12506252B2Dec 23, 2025
Fan-out package structure and fabrication method therefor
INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES0 citations46
US11869872B2Jan 9, 2024
Chip stack packaging structure and chip stack packaging method
INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES0 citations44
US12112956B2Oct 8, 2024
Chip interconnection package structure and method
INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES0 citations43