Inventor

Cui Yinhua

CN2 patents

Patents

2 patents

US11869872B2Jan 9, 2024

Chip stack packaging structure and chip stack packaging method

INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES0 citations44

US12112956B2Oct 8, 2024

Chip interconnection package structure and method

INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES0 citations43