Inventor
UY WILLIAM L
US8 patents
Patents
8 patentsUS10653010B1May 12, 2020
Connection of multilayer printed conductive ink through filled microvias
FLEX LTD5 citations72
US11470717B2Oct 11, 2022
Stress relief encapsulation for flexible hybrid electronics
FLEX LTD0 citations61
US10999926B2May 4, 2021
Stress relief encapsulation for flexible hybrid electronics
FLEX LTD0 citations61
US11064613B2Jul 13, 2021
Electronics encapsulation through hotmelt lamination
FLEX LTD0 citations50
US12156356B2Nov 26, 2024
Electronic encapsulation through stencil printing
FLEX LTD0 citations47
US11493414B2Nov 8, 2022
Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel
FLEX LTD0 citations47
US11289393B2Mar 29, 2022
Methods, devices, and systems for electronic device molding and encapsulation
FLEX LTD0 citations47
US12332131B2Jun 17, 2025
Industrial internet of things (IIOT) in-situ stress real-time monitoring system
FLEX LTD0 citations46