Inventor
TOKUHIRA HIDESHI
JP9 patents
Patents
9 patentsUS6576081B2Jun 10, 2003
Adhesive, bonding method and assembly of mounting substrate
FUJITSU LTD19 citations89
US7502227B2Mar 10, 2009
Electronic apparatus
FUJITSU LTD9 citations83
US7155914B2Jan 2, 2007
Cooling structure for electronic equipment
FUJITSU LTD13 citations83
US7610678B2Nov 3, 2009
Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body
FUJITSU LTD2 citations62
US6790881B2Sep 14, 2004
Adhesive composition
FUJITSU LTD6 citations61
US7551435B2Jun 23, 2009
Heat-absorbing member, cooling device, and electronic apparatus
FUJITSU LTD6 citations58
US7978470B2Jul 12, 2011
Electronic apparatus
FUJITSU LTD1 citations51
US7911795B2Mar 22, 2011
Electronic device including electronic component, heat dissipating member and alloy layer
FUJITSU LTD0 citations50
US7362577B2Apr 22, 2008
Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
FUJITSU LTD0 citations50