Inventor

AHN SEUNGYUN

KR12 patents

⚠️ This page may combine multiple inventors who share the name “AHN SEUNGYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

3 patents

US7863755B2Jan 4, 2011

Package-on-package system with via Z-interconnections

STATS CHIPPAC LTD13 citations84

US7521297B2Apr 21, 2009

Multichip package system

STATS CHIPPAC LTD5 citations62

US7884457B2Feb 8, 2011

Integrated circuit package system with dual side connection

STATS CHIPPAC LTD0 citations51

SONG SUNGMIN

2 patents

US9330945B2May 3, 2016

Integrated circuit package system with multi-chip module

SONG SUNGMIN33 citations93

US8501535B2Aug 6, 2013

Integrated circuit package system with dual side connection and method for manufacturing thereof

SONG SUNGMIN1 citations50

KO WONJUN

1 patent

US8609463B2Dec 17, 2013

Integrated circuit package system employing multi-package module techniques

KO WONJUN11 citations82

YANG DEOKKYUNG

1 patent

US8067306B2Nov 29, 2011

Integrated circuit packaging system with exposed conductor and method of manufacture thereof

YANG DEOKKYUNG11 citations82

KO CHAN HOON

1 patent

US8535981B2Sep 17, 2013

Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof

KO CHAN HOON9 citations80

MIN GAB YONG

1 patent

US8221583B2Jul 17, 2012

System for peeling semiconductor chips from tape

MIN GAB YONG12 citations74

LEE TAEWOO

1 patent

US8258008B2Sep 4, 2012

Package-on-package system with via z-interconnections and method for manufacturing thereof

LEE TAEWOO4 citations60

AHN SEUNGYUN

1 patent

US9093391B2Jul 28, 2015

Integrated circuit packaging system with fan-in package and method of manufacture thereof

AHN SEUNGYUN2 citations56

BAE JOHYUN

1 patent

US8643181B2Feb 4, 2014

Integrated circuit packaging system with encapsulation and method of manufacture thereof

BAE JOHYUN1 citations49