Inventor
WU JYUN-LIN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “WU JYUN-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
9 patentsUS10014252B2Jul 3, 2018
Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitors
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations70
US12382587B2Aug 5, 2025
Methods and systems for improving surface mount joinder
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12424558B2Sep 23, 2025
Bridge die having different surface orientation than IC dies interconnected by the bridge die
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12068300B2Aug 20, 2024
Chip-on-wafer-on-substrate package with improved yield
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations58
US12442742B2Oct 14, 2025
Test structures to determine integrated circuit bonding energies and methods of making and using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12362246B2Jul 15, 2025
Interposer including stepped surfaces and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10847492B2Nov 24, 2020
Semiconductor structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US12362307B2Jul 15, 2025
Semiconductor package with ball grid array connection having improved reliability
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
US9711474B2Jul 18, 2017
Semiconductor package structure with polymeric layer and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations38