Inventor
SAW KHAY CHWAN
MY8 patents
⚠️ This page may combine multiple inventors who share the name “SAW KHAY CHWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS10796981B1Oct 6, 2020
Chip to lead interconnect in encapsulant of molded semiconductor package
INFINEON TECHNOLOGIES AG12 citations83
US11133281B2Sep 28, 2021
Chip to chip interconnect in encapsulant of molded semiconductor package
INFINEON TECHNOLOGIES AG2 citations71
US10741466B2Aug 11, 2020
Formation of conductive connection tracks in package mold body using electroless plating
INFINEON TECHNOLOGIES AG3 citations67
US10325837B2Jun 18, 2019
Molded semiconductor package with C-wing and gull-wing leads
INFINEON TECHNOLOGIES AG2 citations64
US11569196B2Jan 31, 2023
Chip to chip interconnect in encapsulant of molded semiconductor package
INFINEON TECHNOLOGIES AG0 citations61
US11274984B2Mar 15, 2022
Pressure sensor having a lidless/laminate structure
INFINEON TECHNOLOGIES AG0 citations58
US11296000B2Apr 5, 2022
Formation of conductive connection tracks in package mold body using electroless plating
INFINEON TECHNOLOGIES AG1 citations56